VIA Edge AI 3D Developer Kit Launched with Help of Lucid, Qualcomm
VIA Technologies announced this week the launch of a new artificial intelligence software and hardware solution aimed at helping accelerate the depth sensing capabilities of a wide range of devices. The VIA Edge AI 3D Developer Kit, which could have applications ranging from retail and security cameras, to robotics, to autonomous vehicles, is built around two key partnerships: Lucid, an AI-based depth sensing manufacturer, and networking and chip manufacturer Qualcomm.
With Lucid, VIA gets access to the company’s proprietary 3D Fusion Technology, which provides a greater and more accurate depth and 3D sensing technology to the new VIA Edge AI 3D Developer Kit. Lucid, for its part, has successfully developed its own products like the LucidCam while also securing its own partnerships, including one with RED for its coming Hydrogen One smartphone, which is recently hit the market. The brand also has plans to scale its 3D depth sensing technology with other smartphone manufacturers as well. VIA said that as it builds out the long-term roadmap for Edge AI, Lucid will continue to add camera- and machine-learning based depth capabilities on top of every platform.
“Through this exciting partnership, VIA and Lucid together are tackling the fast scaling required by depth sensing with our Edge AI platforms and systems. We see major applications not only for security cameras, but also smart retail, robots, drones, and especially autonomous vehicles,” Richard Brown, Vice-President of International Marketing, VIA Technologies, Inc., said in a statement. “This collaboration will yield a hardware/software combination where VIA provides customizable and embeddable Edge AI developer kits, systems, and cameras with Lucid’s AI solution as an integrated software module. This will provide a tightly-integrated package for all device makers looking to kickstart the development of depth sensing capabilities.”